EP1003
EP1003
THERMALLY CONDUCTIVE EPOXY RESIN
Description
Technical Specifications
TDS/MSDS
Description
EP1003 is a two-component, high strength thermally conductive adhesive, encapsulation and potting compound. It is designed to deploy heat in electronic applications, with a measured thermal conductivity of 3 W/mK. EP1003 has high Tg (greater than 200°C according cure cycle), very low coefficient of thermal expansion (15 ppm/K), high ionic purity, and consequently recommended for encapsulation of electronic components.
Technical Specifications
● CURING PROPERTIES
| Pot Life @ 25 ± 2°C | 8 hr. (%50 viscosity increase) |
| Gel Time | @ 150°C – 8 min. |
| @ 120°C – 25 min. | |
| @ 80°C – 120 min. | |
| Starting curing cycles are: 150°C 175°C |
60 min. 10 min. |
• Lower temperatures (e.g. 110°C) with longer times are possible.
Note that lower cure temperature leads to lower Tg values.
Note that lower cure temperature leads to lower Tg values.
TDS/MSDS
For MSDS request, please send an e-mail to [email protected]