EP 2669
EP 2669
THERMALLY CONDUCTIVE EPOXY RESIN
Description
Technical Specifications
TDS/MSDS
Description
EP2669 is a high performance electrical insulating, thermally conductive epoxy adhesive, potting and
encapsulation compound. A combination of excellent characteristics of thermal conductivity and low
coefficient expansion. EP2669 is a two component room temperature cure system which has an
advantage about storage, shipping and curing for heat sensitive components against one component
systems. Typical applications are; heat sink bonding, casting of magnetic coils, encapsulation of heat
emitting components, transformers and all kind of heat sensitive application.
Technical Specifications
Properties
Base | Viscosity (Catalyzed, 250C, cps) | Color |
---|---|---|
Epoxy | 70,000 | Black |
TDS/MSDS
For MSDS request, please send an e-mail to [email protected]