EP 2669​

EP2669 is a high performance electrical insulating, thermally conductive epoxy adhesive, potting and
encapsulation compound. A combination of excellent characteristics of thermal conductivity and low
coefficient expansion. EP2669 is a two component room temperature cure system which has an
advantage about storage, shipping and curing for heat sensitive components against one component
systems. Typical applications are; heat sink bonding, casting of magnetic coils, encapsulation of heat
emitting components, transformers and all kind of heat sensitive application.

Properties

EP 2669 TDS

For MSDS request, please send an e-mail to [email protected]