EP5310
EP5310
EPOXY POTTING ENCAPSULATION COMPOUND
Description
Technical Specifications
TDS/MSDS
Description
EP5310 is a low viscosity epoxy resin, which is ideal for bonding, coating, potting, encapsulating many different substrates such as plugs, switches, electronic components with metal, plastics and composites materials. 100% solid and solvent free. Advantages are low toxicity, excellent overall physical and electronical properties, good chemical resistance, excellent adhesion, long pot life, low exotherm, low viscosity, low CTE, low shrinkage, very low thermal shock properties.Can be used as, adhesives, coatings, castings, electrical potting and encapsulating, laminating, tooling.
Technical Specifications
● CURING PROPERTIES
| Pot Life @ 25 ± 2°C | Full Cure @ 25 ± 2°C | @ 65 ± 2°C |
|---|---|---|
| 50 min. | 24 hr. | 2 hr. |
TDS/MSDS
For MSDS request, please send an e-mail to [email protected]