EP 5087
EP 5087
THERMALLY CONDUCTIVE EPOXY ADHESIVE
Description
Technical Specifications
TDS/MSDS
Description
EP5087 is a two-component fast curing thermally conductive adhesive, sealant and potting compound.
It is designed to deploy heat in electronic applications, with a measured thermal conductivity of 1.5
W/mK. Suitable for metal, plastics, ceramics and ferrite bonding applications.
Technical Specifications
Properties
| Color | Viscosity (cps) | Mix ratio (by weight or volume) |
|---|---|---|
| Gray | Part A Part B Paste 35000 Cps | 1:1 |
TDS/MSDS
For MSDS request, please send an e-mail to [email protected]