EP 5088
EP 5088
THERMALLY CONDUCTIVE EPOXY ADHESIVE
Description
Technical Specifications
TDS/MSDS
Description
EP5088 is a two-component fast curing, high strength thermally conductive adhesive, sealant and
potting compound. It is designed to deploy heat in electronic applications, with a measured thermal
conductivity of 1.1 W/mK. Suitable for metal, plastics, ceramics and ferrite bonding applications.
Technical Specifications
● CURING PROPERTIES
| Work life time @ 25 ± 2°C, 30g | Gel Time @ 25°C | Full Cure Time |
|---|---|---|
| 25 min | 45 min | @ 25°C 4–6 hours |
| @ 65°C 60 min |
TDS/MSDS
For MSDS request, please send an e-mail to [email protected]